Performance Advantages
● Ultra-Low Viscosity and Excellent Fluidity: Ensures efficient flow and heat transfer.
● High Specific Heat Capacity and Thermal Conductivity: Enhances cooling efficiency, reducing data center energy consumption.
● Low Electrical Conductivity and High Dielectric Strength: High breakdown voltage ensures operational safety for electronic components.
● High Oxidation and Hydrolytic Stability: High flash point and ignition temperature improve safety.
● Environmentally Friendly: Zero global warming potential (GWP) and high biodegradability.
● Material Compatibility: Works with computing/storage components, data cables, seals, and metals.
● High Purity and Safety: Free of sulfur, aromatics, gums, and heavy metals; non-toxic and NSF certified for food-grade contact.
● Low Volatility and Long Service Life: Minimal evaporation and loss within operating temperature range.
Applications
Recommended for immersion cooling of computing, storage, and information exchange equipment in data centers, supercomputing centers, AI infrastructure, 5G communication base stations, gaming, medical, and power systems.